Ziziphi iingenelo zomatshini wokumakisha we-UV laser?

Ngenkqubela phambili yetekhnoloji kunye nokwanda kolwazi lwabantu ngokhuseleko lokusingqongileyo,oomatshini bokumakisha laserziye zasetyenziswa ngokubanzi kwiinkalo ezininzi nangakumbi.Xa kuthelekiswa noomatshini bokumakisha bemveli, ukusebenza koomatshini bokumakisha laser kulula ukuyisebenzisa, ukusetyenziswa kwamandla aphantsi, ukugcinwa kwamahhala.Ngokukodwa umatshini wokumakisha we-laser we-UV, ngenxa yendawo encinci egxininisekile kunye nokusetyenzwa kwendawo echaphazelekileyo yobushushu, unokuphawula izinto ezikhethekileyo, eyona nto ikhethwa kuqala kubathengi abaneemfuno eziphezulu zokumakisha isiphumo.

1. Malunga ne-UV laser marking machine

Umgaqo wokusebenza weUmatshini wokumakisha we-laser we-UViyafana naleyo yabanye oomatshini bokumakisha ngelaser.Isebenzisa umqadi we-laser ukuphawula ngokusisigxina umphezulu wezinto ezahlukeneyo.Isiphumo sokumakisha kukwaphula ngokuthe ngqo ikhonkco lemolekyuli yento ngokusebenzisa i-laser ye-wavelength emfutshane, ukuze kuboniswe iphethini yokumakisha efunekayo kunye nesicatshulwa.Umatshini wokumakisha we-laser we-UV uphuhliswe nge-355nm kwaye wamkela itekhnoloji yokuphinda-phinda kabini itekhnoloji yeodolo yesithathu ye-intracavity.Xa kuthelekiswa ne-laser ye-infrared, umatshini wokumakisha we-UV we-laser unendawo encinci yokugxila, enokunciphisa kakhulu ukuguqulwa komatshini wezinto eziphathekayo kunye nokucubungula.Impembelelo encinci ye-thermal.Ngoko ke, umatshini wokumakisha we-UV laser usetyenziswa ikakhulu ekuphawuleni okugqwesileyo.

2. Izinto eziluncedo zokumakisha umatshini we-laser we-UV

①Ubomi obude bokusebenza
②Ugcino lwasimahla
③Ukusetyenziswa okuphantsi
④Ubungakanani besaml kunye nobunzima obulula
⑤Ukusebenza kakuhle
⑥umgangatho olungileyo webeam kunye nendawo encinci yokugxila, ukuphawulwa okugqibeleleyo.

3.Amashishini asebenzayo kwiilaser ze-UV

Umgangatho we-beam kunye nendawo yokugxila yeUmatshini wokumakisha we-laser we-UVzincinci, ezinokufikelela nakwi-odolo ye-nanometers, efanelekile ngokukodwa kwimarike ephezulu ye-ultra-fine processing.Njengeemveliso ze-elektroniki ze-3C, ukupakishwa kwamayeza, ishishini lobucwebe, kunye nokumakishwa kwemveliso yeglasi ephezulu njl.njl.